OEM for PMMA, MS and LGP
LED Cutting
Wafer Drilling/Cutting
Are you still troubled owing to the printing screen of long production time and the revision of high costs?
We provides LED laser cutting sample test services.
Laser cutting processing can replace traditional wheel cutting, and easy to reduce the width of the lanes to 30um, and the cutting speed can reach 100mm / s or more. Laser cutting, do not need others supplies and coolant exact charges. Welcome to call LED laser cutting proofing and foundry services, thank you.
Division of the laser drilling / cutting machine integration precision adjustment each component of optical, mechanical and electrical to achieve the micron-level accuracy, especially the UV laser light source for PCB drilling, flexible circuit board drilling or all kinds of wafer drilling / dicing, etc., to meet the needs of the industry foundry. The process optimization, technology integration for laser light parameters, beam modulation, focusing optical parameters, control and optimization of mechanical and electrical parameters for the combination of commissioning, and then using double-sided high aspect ratio laser processing. Beacuse of two-way processing technology in the double-sided front and back drilling, that can enhance the high aspect ratio and flatness.
TEL:03-5679088
FAX:03-5638529
ADD:300新竹科學工業園區園區二路56號1樓
ADD:1F,No.56~58,Park Ave.2,Science-Based Industrial Park Hsin Chu City,Taiwan 300, R.O.C.